The next step is an open chiplet ecosystem and ubiquitous interconnect at the package level. To satisfy the ever-increasing demand for more computing power, Intel and many of our colleagues in the semiconductor industry have come to the same conclusion: The future of chip innovation lies in moving to modular designs based on “chiplet” building blocks, essentially moving from system-on-chip (SoC) to System-on-Package (SoP) chip architectures. The feasibility of implementing complex systems on monolithic dies is reaching its physical and economic limits. Gordon Moore predicted this “Day of Reckoning” in his seminal 1965 white paper, “Cramming More Components Onto Integrated Circuits,” writing that as chip density and complexity progressed, eventually “it may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected.” The industry’s increasing adoption of modular semiconductor design takes us into the realm of SoP, giving